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Product Name:phone mainboard pcb

Material:FR-4

Layers:6 layers(1+4+1)

Thickness:1.0mm

Surface Finish : Immersion Gold +OSP

Copper thickness for outer layers:1OZ

Min. trace width/Min. trace space:3mil/3mil

Min.Drilling holes size:0.2MM

A plurality of single ended to differential impedance control

 

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