FB体育官方网站 SI10U特点: 低CTE,高模量,可有效降低封装基板的翘曲,优异的耐湿热性,良好的PCB加工性,无卤材料,TG280
应用领域:eMMC, DRAM, AP, PA, Dual CM, Fingerprint, RF Module
下载FB体育官方网站SI10U材料规格书
Items | Condition | Unit | SI10U(S) |
---|---|---|---|
Tg | DMA | ℃ | 280 |
Td | 5% wt. loss | ℃ | >400 |
CTE (X/Y-axis) | Before Tg | ppm/℃ | 10 |
CTE (Z-axis) | α1/α2 | ppm/℃ | 25/135 |
Dielectric Constant 1) (1GHz) | 2.5.5.9 | - | 4.4 |
Dissipation Factor 1) (1GHz) | 2.5.5.9 | - | 0.007 |
Peel Strength1) | 1/3 OZ, VLP Cu | N/mm | 0.80 |
Solder Dipping | @288℃ | min | >30 |
Young's modulus | 50℃ | GPa | 26 |
Young's modulus | 200℃ | GPa | 23 |
Flexural Modulus1) | 50℃ | GPa | 32 |
Flexural Modulus1) | 200℃ | GPa | 27 |
Water Absorption1) | A | % | 0.14 |
Water Absorption1) | 85℃/85%RH,168Hr | % | 0.35 |
Flammability | UL-94 | Rating | V-0 |
Thermal Conductivity | - | W/(m.K) | 0.61 |
Color | - | - | Black |