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High frequency board process technology and quality control

High frequency microwave printing is a printed circuit at high frequencies (frequency of 300 mhz or less) and microwaves (frequency of 3 GHz or wavelength less than 0.1 m).

Special treatment of copper substrates containing microwaves and certain methods.

High frequency card application:

1. Mobile communication products.

2. Power amplifiers, low noise amplifiers, etc.

3. GSM, CDMA, intelligent 3G antenna.

4. Passive devices such as combiners, power lenses, replicators, filters and couplers.

High frequency table classification:

1. Thermosetting materials filled with ceramic powder:

A. Manufacturer: Rogers Arlon TLG Series TLG Series

b. Treatment: According to the usual FR4 method, the plate is fragile and easily broken, and the life of the drilling and milling cutter is shortened by 20% in drilling and copper.

2. PTFE material Rogers series R0000, series RT series, TMM series, Aron Ad / AR, series DICLD, series CUClad, series ISOLAD series, series TLTE series TLE series TLE series TLX series TLX series TLZ series TLZ series TLZ series N9000, Taiding Mikwavees F4B, F4T Series TP, TP Series and TP Series Main PTFE material: 1. Material composition: PTFE (polytetrafluoroethylene, abbreviations)

2. Substance mark: a: Household materials:

F4B is a mixture of PTFE and glass fabric Telephone:

2.55, 2.65, 2.75, 2.85, 2.93, 3.0, 3.3, 3.5 Features: low cost, low cost, high adhesion copper Imported materials:

TaConic, Rogers, Geteck, Ecoc and Aron. Characteristics of the telescope: R. DK dielectric constant is less than FR4 (the lower the dielectric constant, the shorter the electrical signal.) The dielectric constant of FR4 is

4.3. The high frequency card is usually 2 - 3.5 B and the temperature of the TG is higher than FR4 (TG is the temperature required for the glass converter when pressed).

TG is normal: FR4: 130C, high TGFR4 is 150 degrees Celsius, 170 degrees C, and high frequency board is usually (> 170c). process:

1. Manufacturing TV board: power supply - drilling - dry inspection - etching - corrosion - welding - resistance - resistance - tin (surface treatment) - test - test - final inspection - packaging and delivery

2. Focused PTH board manufacturing: power supply - drilling treatment - processing (plasma processing or sodium attack) - copper - electroplating plating inspection - etching - etching - soldering - resistors (surface treatment) - forming - final inspection - inspection - packaging -delivery Product quality characteristics and quality control, FR4 products in the production process:

1. Open: The protective film must be stored to avoid scratches and shielding.

a. Drilling b. Laminate:

b. drilled holes, less than 1.6 mm in laminate, used in laminates over 1.6 mm.

C. The phenol board is used as a recovery board for imported materials and aluminum sheets for household materials.

D. The drilling speed is 20% slower than the FR4 plate speed.

E. If there is a batch of facades at the edge of the hole, a piece of toilet paper and 2000 sandpaper will be used. Without mechanical polishing, it is easy to cause expansion and elongation to avoid printing the surface with

abrasive paper. 3. Hole treatment: a. High frequency perforating agent, filled in half an hour.

4. Copper oil field:

a. Before casting copper, the gravel mark must be confirmed: 8-12 mm.

b. Copper deposits cannot be confirmed by backlighting and used in a fragrance box to verify the effect of copper deposits, using a nine-hole mirror.

c. Rough surfaces and copper grain must be treated with 2000 years of corrugated paper.

5. Chart:

a. Before correcting the license plate, confirm the whole: 8-12 mm.

b. Width deviation ensures that within the “meter” compensation range, the difference between width and width does not exceed (+ 0.01 mm).

c. After development, the free space rocket cannot be filled to avoid duplication.

6. Electrogram and electricity:

a. Control clamping, rough surfaces, pinholes, fingerprints and other issues.

b. Thickness of Corporal Copper: The lowest is 18 Um with an average of 20 UM.

7. Etching:

a. The line width is + 10%.

b. The etched plate not only touches the substrate within the panel to prevent contamination of the surface of the substrate from affecting the adhesion of the green oil.

8. Welding strength:

A. Pretreatment: Acid wash plate, no mechanical brush.

b. Cooking plates before and after processing: 85 degrees, 30 minutes. C. Use good adhesion inks such as Sun:SUN:PSR-4000, PSR-2000.Time: 30 minutes to 1 hour.

D. Check for defects in the green plate, direct and reprint green oil before alignment.

E. Green oil post-treatment: All high-frequency boards must be carried out by various departments.

Paragraph

1: 50C for 1 hour. Section

2: Level 70C, one hour. Section

3: 100 minutes and 30 minutes. Section

4: 120 C 30 minutes Paragraph 5: 150 C for 1 hour.

9. Spray tin

a. Cooking plate for spraying before welding: 140 ° C * 60 minutes.

b. Non-resistive brazing sheet: 110 degrees c * 60 minutes, 150 ° C (60 ° C).

c. This plate should be sprayed as hot as possible to avoid its disappearance.

10 .Gongan:

A. Use special procedures and inflation.

b. The inflation rate should be 20% lower than the speed of FR-4.

C. The new Falun Gong has a life span of 10 meters and 1 branch.

d. To avoid damage to the base material and the copper surface, the rear stern should be carefully cut and placed on the seal.

11. Packaging:

R. Because cardboard is flexible and easily deformed, it is best to use old cardboard to protect the vacuum packaging on both sides.

b. The currency board must be separated from the paper in the absence of sulphur to avoid oxidation. Conclusion: Difficulties encountered in the manufacture of high frequency panels.

A. Copper deposition: It is not easy to deposit copper on the walls of the holes.

b. Graphic rotation, etching, line width spacing, sand hole control. c. Green oil method: control of green oil adhesion and foam formation.

d. Strictly control scratches, bottles and other defects in each process.