Item |
Technics capacity |
Layers |
1--48 |
Material |
FR-4 、 Insulated Metal Substrate、High frequency material etc. |
Max. manufacturing size |
500mm X1200mm |
Outline tolerance |
± 0.1mm |
Board thickness range |
0.20mm--8.00mm |
Board thickness tolerance (t≥1.0mm) |
± 10% |
Board thickness tolerance(t<1.0mm) |
± 0.1mm |
Core thickness |
0.075mm--5.00mm |
Min. trace width(HOZ base copper for outler layer ) |
0.075 mm |
Min. trace space(HOZ base copper for outler layer ) |
0.075 mm |
Min. trace width(1OZ base copper for outler layer ) |
0.125 mm |
Min. trace space(1OZ base copper for outler layer ) |
0.125 mm |
Min. trace width(2OZ base copper for outler layer ) |
0.18 mm |
Min. trace space(2OZ base copper for outler layer ) |
0.18 mm |
Min. trace width(3OZ base copper for outler layer ) |
0.23 mm |
Min. trace space(3OZ base copper for outler layer ) |
0.23mm |
Copper thickness for outer layers |
35um--175um |
Copper thickness for inner layers |
17um--175um |
Drilling holes size |
0.10mm--6.35mm |
Finish holes size |
0.10mm--6.30mm |
Hole size tolerance |
±0.05mm |
Hole position tolerance |
±0.075mm |
Aspect ratio |
12:1(drill hole>0.30MM) , 8:1(drill hole≤0.30MM) |
Solder mask type |
Liquid photoimageable solder resist ink |
Solder mask color |
white、black、blue、green、yellow、red etc. |
Min. solder mask bridge |
0.125mm(black),other 0.10mm |
Min. solder mask clearance ring
|
0.05mm |
Plug holes range |
0.25mm--0.65mm |
Impedance tolerance |
± 10% |
Au & Ni thickness for Immersion gold thickness Au thickness: |
2~4U",Ni thickness: 120~200U |
Au & Ni thickness for gold fingers |
Au thickness: 5~30U",Ni thickness: 120~200U |
Copper in hole wall |
20~25UM |
Surface finish type |
Hasl/Lead free Hasl、Immersion gold、Immersion Tin、Immersion silver, OSP,etc |